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PRODUCT > SOLDER PASTE
   Soldering paste
The quality of the tin solder paste directly affects the quality of the product. Problems of printing speed, cohesion ,bridge connections after refluxing, insufficient wetting, cold solder joint and rosin joint are all related to the quality of tin solder paste. Therefore, it is important to select proper solder paste according to the equipments and technics conditions of each factory.
Made up of high-quality alloy powder and solder flux with high stability, the tin solder paste of our company is with advantages as below:

Excellent printing property: Elimination circumstances of omission,
   depression and agglomeration£»

Good wetting property, full solder spot, equal printing. Keep viscosity for
    a long time after PCB. Applicable to different refluxing welder and different
    temperature curve.

 
 
Types of the Solder Paste£º
Alloy melting temperature of the solder: normal temperature£¨183oC£©,high temperature, low temperature.
Types of the solder flux: Rosin-core, No-clean, Water soluble.
Types of the alloy: lead type, lead-free type.
Size of the alloy:£¨22¦Ìm£­45¦Ìm£©¡¢£¨45¦Ìm£­75¦Ìm£©.
 
 
The tin cream returns to flux song coil (Sn 63Pb37¡¢ Sn 62Ag2Pb36)
 
The tin cream examines
Item Examination result
Product elucidation Unleaded series
flux Category RMA
The copper mirror decays a Qualified
The surface insulates resistance
Was worth in the early years>1 x
added a wet empress>1 x
The aqueous solution compares electric resistance Qualified
The chrome sour silver tries a paper >1000 ¦¸m
The anti- spreads Kind >85%
 
The copperplate prints a way
Item Elucidation Sn/Ag/Cu
Viscosity 750¡À50kcps
Slump £¼0.2mm
Tcp 120gm
Flux Content 11.5¡À1%
Printability
Orientation in
 
 
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