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PRODUCT > LEAD-FREE ALLOY
YC305 Characteristic Value YC305 Physical Properties YC707 Characteristic Value
Sn-Ag Eutectic Composition
The microscopic Structure of Sn-Ag

Characteristic of Yuecheng YC305 Lead-free Tin Solder:

The melting point of the eutectic composition of Sn-Ag lead-free tin solder is 221oC, with good mechanism performance, mechanical performance, soldering performance, stability and wettingperformance. The tensile strength and expandability is better than ordinary solder. The grea performance can be seen in the tolerance, which is markedly superior to Sn-Pb series and is most applicable to equipments requiring long-term stability.

 
 
 
 
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